Realize water-guided laser cutting and drilling of flat workpieces and complex special-shaped parts, suitable for processing of compound semiconductors, metals, ceramic materials/hard alloys, various gemstones, composite materials and other materials.

The 30-100μm water-beam optical fiber containing high-energy laser can achieve drilling and cutting of super-hard materials and difficult-to-machine materials without taper. After changing the height of the processing surface, there is no need to re-adjust the focus or control the distance.

- The highest accuracy can reach ±3μm, and the processed surface quality can reach Ra0.8μm

- By introducing micro-jet with nanosecond laser and forming total internal reflection, the surface quality of the processed area is excellent, with almost no slag, recast layer and heat-affected zone.

The depth-to-width ratio of cutting can reach 100:1, and the depth-to-diameter ratio of micro-hole processing can reach 30:1.